APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 1 C 7 s3 g3 s4 g4 nt c2 s1 g1 out2 out1 vbus q1 q2 s2 g2 0/vbu s nt c1 q3q4 absolute maximum ratings these devices are sensitiv e to electrostatic discharge. proper handling procedures should be followe d. see application note apt0502 on www.microsemi.com symbol parameter max ratings unit v dss drain - source breakdown voltage 200 v t c = 25c 104 i d continuous drain current t c = 80c 77 i dm pulsed drain current 416 a v gs gate - source voltage 30 v r dson drain - source on resistance 19 m ? p d maximum power dissipation t c = 25c 390 w i ar avalanche current (repetitive and non repetitive) 104 a e ar repetitive avalanche energy 50 e as single pulse avalanche energy 3000 mj v dss = 200v r dson = 16m ? typ @ tj = 25c i d = 104a @ tc = 25c application ? welding converters ? switched mode power supplies ? uninterruptible power supplies features ? power mos 7 ? fredfets - low r dson - low input and miller capacitance - low gate charge - fast intrinsic reverse diode - avalanche energy rated - very rugged ? kelvin source for easy drive ? very low stray inductance - symmetrical design - lead frames for power connections ? internal thermistor for temperature monitoring ? high level of integration benefits ? outstanding performance at high frequency operation ? direct mounting to heatsink (isolated package) ? low junction to case thermal resistance ? solderable terminals both for power and signal for easy pcb mounting ? low profile ? rohs compliant full - bridge mosfet power module downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 2 C 7 all ratings @ t j = 25c unless otherwise specified electrical characteristics symbol characteristic test conditions min typ max unit v gs = 0v,v ds = 200v t j = 25c 250 i dss zero gate voltage drain current v gs = 0v,v ds = 160v t j = 125c 1000 a r ds(on) drain C source on resistance v gs = 10v, i d = 52a 16 19 m ? v gs(th) gate threshold voltage v gs = v ds , i d = 2.5ma 3 5 v i gss gate C source leakage current v gs = 30 v, v ds = 0v 100 na dynamic characteristics symbol characteristic test conditions min typ max unit c iss input capacitance 7220 c oss output capacitance 2330 c rss reverse transfer capacitance v gs = 0v v ds = 25v f = 1mhz 146 pf q g total gate charge 140 q gs gate C source charge 53 q gd gate C drain charge v gs = 10v v bus = 100v i d =104a 67 nc t d(on) turn-on delay time 32 t r rise time 64 t d(off) turn-off delay time 88 t f fall time inductive switching @ 125c v gs = 15v v bus = 133v i d = 104a r g = 5 ? 116 ns e on turn-on switching energy 849 e off turn-off switching energy inductive switching @ 25c v gs = 15v, v bus = 133v i d = 104a, r g = 5 ? 929 j e on turn-on switching energy 936 e off turn-off switching energy inductive switching @ 125c v gs = 15v, v bus = 133v i d = 104a, r g = 5 ? 986 j source - drain diode ratings and characteristics symbol characteristic test conditions min typ max unit tc = 25c 104 i s continuous source current (body diode) tc = 80c 77 a v sd diode forward voltage v gs = 0v, i s = - 104a 1.3 v dv/dt peak diode recovery ? 5 v/ns t j = 25c 230 t rr reverse recovery time t j = 125c 450 ns t j = 25c 0.9 q rr reverse recovery charge i s = - 104a v r = 133v di s /dt = 100a/s t j = 125c 3.4 c ? dv/dt numbers reflect the limitations of the circuit rather than the device itself. i s ? - 104a di/dt ? 700a/s v r ? v dss t j ? 150c downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 3 C 7 thermal and package characteristics symbol characteristic min typ max unit r thjc junction to case thermal resistance 0.32 c/w v isol rms isolation voltage, any terminal to case t =1 min, 50/60hz 4000 v t j operating junction temperature range -40 150 t stg storage temperature range -40 125 t c operating case temperature -40 100 c torque mounting torque to heatsink m5 2.5 4.7 n.m wt package weight 160 g temperature sensor ntc (see application note apt0406 on www.microsemi.com for more information). symbol characteristic min typ max unit r 25 resistance @ 25c 50 k ? b 25/85 t 25 = 298.15 k 3952 k ?? ? ?? ? ? ?? ? ? ?? ? ? ? t t b r r t 1 1 exp 25 85/25 25 sp4 package outline (dimensions in mm) see application note apt0501 - mounting instructions for sp4 power modules on www.microsemi.com t: thermistor temperature r t : thermistor value at t downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 4 C 7 typical performance curve 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration (seconds) thermal impedance (c/w) maximum effective transient thermal impedance, junction to case vs puls e duration 6.5v 7v 7.5v 8v 8.5v 10v v gs =15v 9v 0 100 200 300 400 500 600 700 0 4 8 1216202428 v ds , drain to source voltage (v) i d , drain current (a) low voltage output characteristics transfert characteristics t j =-55c t j =25c t j =125c 0 50 100 150 200 250 300 012345678910 v gs , gate to source voltage (v) i d , drain current (a) v ds > i d (on)xr ds (on)max 250s pulse test @ < 0.5 duty cycle r ds(on) vs drain current v gs =10v v gs =20v 0.8 0.9 1 1.1 1.2 0 25 50 75 100 125 150 i d , drain current (a) r ds(on) drain to source on resistance normalized to v gs =10v @ 52a 0 20 40 60 80 100 120 25 50 75 100 125 150 t c , case temperature (c) i d , dc drain current (a) dc drain current vs case temperature downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 5 C 7 0.90 0.95 1.00 1.05 1.10 1.15 -50 -25 0 25 50 75 100 125 150 t j , junction temperature (c) bv dss , drain to source breakdown volta g e ( normalized ) breakdown voltage vs temperature on resistance vs temperature 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 125 150 t j , junction temperature (c) rds(on), drain to source on resistance (normalized) v gs =10v i d = 52a threshold voltage vs temperature 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -50 -25 0 25 50 75 100 125 150 t c , case temperature (c) v gs (th), threshold voltage (normalized) maximum safe operating area 100ms 10ms 1ms 100s 1 10 100 1000 1 10 100 1000 v ds , drain to source voltage (v) i d , drain current (a) single pulse t j =150c t c =25c limited by r dson ciss crss coss 100 1000 10000 100000 0 1 02 03 04 05 0 v ds , drain to source voltage (v) c, capacitance (pf) capacitance vs drain to source voltage v ds =40v v ds =100v v ds =160v 0 2 4 6 8 10 12 14 0 20 40 60 80 100 120 140 160 gate charge (nc) v gs , gate to source voltage (v) gate charge vs gate to source voltage i d =104a t j =25c downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 6 C 7 delay times vs current t d(on) t d(off) 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 i d , drain current (a) t d(on) and t d(off) (ns) v ds =133v r g =5 ? t j =125c l=100h rise and fall times vs current t r t f 0 20 40 60 80 100 120 140 160 0 25 50 75 100 125 150 175 i d , drain current (a) t r and t f (ns) v ds =133v r g =5 ? t j =125c l=100h switching energy vs current e on e off e off 0 0.5 1 1.5 2 0 25 50 75 100 125 150 175 i d , drain current (a) e on and e off (mj) v ds =133v r g =5 ? t j =125c l=100h e on e off 0.5 1 1.5 2 2.5 3 0 5 10 15 20 25 30 35 40 45 50 gate resistance (ohms) switching energy (mj) switching energy vs gate resistance v ds =133v i d =104a t j =125c l=100h hard switching zcs zvs 0 50 100 150 200 250 300 25 38 50 63 75 88 100 i d , drain current (a) frequency (khz) operating frequency vs drain current v ds =133v d=50% r g =5 ? t j =125c t c =75c t j =25c t j =150c 1 10 100 1000 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 v sd , source to drain voltage (v) i dr , reverse drain current (a) source to drain diode forward voltage downloaded from: http:///
APTM20HM16FTG APTM20HM16FTG C rev 3 october, 2012 www.microsemi.com 7 C 7 disclaimer the information contained in the document (unless it is publicly available on the web without access restrictions) is proprietary and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the ter ms of such agreement will also apply. this document and the information contained herein may not be modified, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication , inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an officer of microsemi. microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with li fe- support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microsemi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or custo mers final application. user or customer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp life support application seller's products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the seller's product could create a situation where personal injury, death or property damage or loss may occur (collectively "life support applications"). buyer agrees not to use products in any life support applications and to the extent it does it shall conduct extensive testing of the product in such applications and further agrees to indemnify and hold seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, dam ages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damag e or otherwise associated with the use of the goods in life support applications, even if such claim includes allegations that seller was negligent regarding the design or manufacture of the goods. buyer must notify seller in writing before using sellers products in life support applications. seller will study with buyer alternative solutions to meet buyer application specification based on sellers sales conditions applicable for the new proposed specific part. downloaded from: http:///
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